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0015_ Microelectronics_ Perfect Edge Failed Wire Bond
0014_ Microelectronics_ Perfect Edge Wire Bond Pad
Au based metallisation high power package
Beryllia Substrate
Failed BGA
Im tin_comparison to ion etch_02596_08 1 Fresh mech pol m20kx1
flower_02539_13 U36 inc 8 Ball A8 x15k
BGA small crack no failure
BGA small crack
BeO under top layer

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